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2-/4-/6-/8-Channel, ±30kV ESD Protectors in μDFN
During an ESD event, the current pulse rises from zero
to peak value in nanoseconds (Figure 3). For example,
in a ±15kV IEC-61000-4-2 Air-Gap Discharge ESD
event, the pulse current rises to approximately 45A in
1ns (di/dt = 45 x 10 9 ). An inductance of only 10nH adds
an additional 450V to the clamp voltage. An inductance
of 10nH represents approximately 0.5in of board trace.
Regardless of the device’s specified diode clamp volt-
age, a poor layout with parasitic inductance significantly
increases the effective clamp voltage at the protected
signal line.
A low-ESR 0.1μF capacitor must be used between V CC
and GND. This bypass capacitor absorbs the charge
transferred by a +14kV (MAX13204E/MAX13206E/
MAX13208E) and ±12kV (MAX13202E) IEC61000-4-2
Contact Discharge ESD event.
Ideally, the supply rail (V CC ) would absorb the charge
caused by a positive ESD strike without changing its
regulated value. In reality, all power supplies have an
±30kV ESD Protection
ESD protection can be tested in various ways. The
MAX13202E/MAX13204E/MAX13206E/MAX13208E are
characterized for protection to the following limits:
? ±15kV using the Human Body Model
? ±14kV (MAX13204E/MAX13206E/MAX13208E) and
±12kV (MAX13202E) using the Contact Discharge
method specified in IEC 61000-4-2
? ±30kV using the IEC 61000-4-2 Air-Gap Discharge
method
ESD Test Conditions
ESD performance depends on a number of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
effective output impedance on their positive rails. If a
power supply’s effective output impedance is 1 ? , then
by using V = I × R, the clamping voltage of V C increas-
R C
1M ?
R D
1.5k ?
es by the equation V C = I ESD x R OUT . An ±8kV
IEC 61000-4-2 ESD event generates a current spike of
24A, so the clamping voltage increases by V C = 24A ×
1 ? , or V C = 24V. Again, a poor layout without proper
bypassing increases the clamping voltage. A ceramic
chip capacitor mounted as close to the MAX13202E/
HIGH-
VOLTAGE
DC
SOURCE
CHARGE-CURRENT-
LIMIT RESISTOR
Cs
100pF
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
DEVICE
UNDER
TEST
MAX13204E/MAX13206E/MAX13208E V CC pin is the
best choice for this application. A bypass capacitor
should also be placed as close to the protected device
as possible.
Figure 4. Human Body ESD Test Model
I
100%
90%
I P 100%
90%
Ir
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
AMPERES
36.8%
10%
10%
0
t R = 0.7ns to 1ns
30ns
60ns
t
0
t RL
TIME
t DL
CURRENT WAVEFORM
Figure 3. IEC 61000-4-2 ESD Generator Current Waveform
Figure 5. Human Body Model Current Waveform
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相关代理商/技术参数
MAX13204EALT-T 功能描述:TVS二极管阵列 RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
MAX13204EELT+ 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
MAX13204EELT+T 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
MAX13206EALA 制造商:Maxim Integrated Products 功能描述:LOW-CAPACITANCE 4-/6-/8-CHANNEL + - Rail/Tube
MAX13206EALA+ 制造商:Maxim Integrated Products 功能描述:ESD PROTECTORS 8PIN UDFN - Rail/Tube
MAX13206EALA+T 功能描述:TVS二极管阵列 6Ch ESD Protection Diode Array RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
MAX13206EALA-T 功能描述:TVS二极管阵列 RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
MAX13206EELA+ 制造商:Maxim Integrated Products 功能描述: